目的Purpose规定锡膏储存，使用的要求。Thisfileprovidesaproperoperationinstructionforthestorageandusageofsolderpaste.范围Scope 2．1 适用于锡膏的储存，使用指导。 参考资料Reference 3. 1 INDIUM公司：RMA-SMQ51AC， NC-SMQ92J 锡膏规格书;INDIUM company:RMA-SMQ 52AC，NC-SMQ921J solder paste TDS;3. 2 ALFHA METALS 公司: OM-5000， RMA-390DH4， UP78锡膏规格书，ALFHAMETALS company: OM-5000， RMA-390DH4， UP78 solder pasteTDS.3. 3 MULTICORE公司锡膏规格书MULTICORE company : NC62， AL32 solder paste TDS.3. 4 KESTER 公司：R-270HPS锡膏规格书KESTER company : R-270HPS solder paste TDS. 定义 Definition FIFO: 先进先出FIFO：Firstin/First out.TDS: 产品规TDS: Technical data sheetMSDS: 产品安全规格书MDSD: Materialsafety data sheet. 应用设备/材料Application Equipment/material 5. 1 冰箱Refrigerator5．2 干燥箱Dry cabinet5．3 月份标签Monthlylabel5．4 锡膏控制标签Solderpaste control label5.5 回收锡膏使用标签solderpaste reuse label. 程序Procedure 6．1 流程图（附件1）Flow chartof control solder paste.(see appendix1)6．2 物流的控制Controlof logistics6．2．1采购Procurement采购员应要求锡膏的供应商所供应的产品须冷藏包装，而且具备“供货剩余寿命”的要求。 Buyer must informed supplier of paste provide ”shipped balance shelflife” for goods， Pastemust cold storage.6. 2. 2 接收Receival运输来的锡膏和贴片胶须包裹在干冰，化学冷冻剂中。The solder paste and adhesive epoxy must bepacked in dry ice and chemical coolant.仓管员在收到锡膏后，清点数量，进料校验部门根据每种锡膏的“冷藏储存寿命“和”供货剩余寿命“检查是否过期，如果过期则不可以使用。（报MRB处理）After the storage keeper received thesolder paste， he must account the quantity and check whether it is overdueaccording”shelf lift at cold storage” and “shipped balance shelf lift”， itcould not be used and should be MRB if it is overdue.张贴“月份标签”（参考FOP-STR-02文件）。Paste the monthly label (Refer toFOP-STR-02).6．2．3 储存Storage张贴“月份标签”之后，立即存入冰箱，并按照不同品名分类放置。After paste the Month Label ， you must putthe solder paste and adhesive epoxy into refrigerator ，then place themrespectively according to their different kinds .B. 锡膏罐直放置，贴片胶针筒倒立放置。The paste jar must up storage and adhesive must tip downstorage.冰箱温度：按照锡膏的冷藏要求（附件2）。Keep the temperature of refrigerator byappendix2.D. 仓管员每班检查冰箱，记录于“冰箱温度班检查记录JE017C中（附件4）。任何异常情况和所采取的改善行动记录于附表4.The storage keeper should check thetemperature of refrigerator， then keep record in Shift Refrigerator TemperatureCheck Form.(JE017Csee attach file 4) Any Abnormity record and corrective actioninto appendix 46．2．4 发料Issue materials to production仓管员按照“先进先出”原则发料。Keep the rule FIFO.6.3生产部的控制Control of Production6．3．1 接收Receival生产部在收到锡膏后，清点数量. 根据每种锡膏和贴片的“冷藏储存寿命“和”供货剩余寿命“检查是否过期如果过期则不可以使用。（报MRB处理）.After they received the solder paste， hemust account the quantity and check whether it is overdue according”shelf liftat cold storage” and “shipped balance shelf lift”， it could not be used andshould be MRB if it is overdue.6．3．2 储存Storage清点数量之后，立即存入冰箱，并按照不同品名分类放置。After account the quantity， put the solderpaste and adhesive epoxy into refrigerator， and place them respectivelyaccording to their different kindsB. 锡膏罐直放置，贴片胶针筒倒立放置。Thepaste jar must up storage must tip down storage.冰箱温度：按照锡膏的冷藏要求（附件2）。Keep the temperature of refrigerator byappendix2.生产部每班检查冰箱，记录于“冰箱温度班检查记录JE017C中（附件4）。任何异常情况和所采取的改善行动记录于附表4.Check the temperature of refrigerator pershift， then keep record in shift Refrigerator Temperature Check Form.(JE017C，seeattach file 4) Any Abnormity record and corrective action into appendix 4.6．3．3 使用Usage车间的印刷机区域的温度/湿度：参考MEI-OE-0097“生产环境控制”文件。Floor and printing machine temperature andhumidity must according MEI-OE-0097documents.B. 按照“先进先出”原则取出锡膏。Adopt the solder paste according to therule FIFO.C. 取出锡膏后根据每种锡膏的“冷藏储存寿命”和“供货剩余寿命”，检查是否过期如果过期则不可以使用。（报MRB处理）Before use the solder paste， check whether itis overdue according”shelf lift at cold storage” and“shipped balance shelf lift”， it could notbe used and should be MRB if it is over use.D. 取出锡膏后在室温下进行回温解冻，时间依据附表2要求， 记录于“锡膏取用记录JE019B”（附件3）在瓶上张贴“锡膏控制标签”（附件5）.After extraction from the refrigerator，they must be thawed for 4 hoursbefore use in the room temperature. Take the record in Solder Paste Usage Form(JE019B)，see attach file 3).Then paste the Solder Paste Control Label on thebottle.(see attach file 5)E. 使用时，自锡膏罐遵循“多次填加，每次少量”的原则，取出添加到丝网上的。取出后需要重新盖上锡膏罐，避免敞开锡膏罐盖.According to“More Times added， Low volume ” for stencil added.Re-seal opened jar or syrinesnot open during storage.在丝网上的锡膏必须在1小时（参考其on-stencil life）内使用完毕，超期报MRB处理。遇长期时间停机或更换产品型号，如果未超过1小时则将丝网上的锡膏放在一个干净的罐中，填写“锡膏回收使用标签”（附件6）作为“可重复使用”的标识，下次优先回温使用。从印刷到回流时间间隔不能超过45分钟.Paste on stencil must within one hours(according to “on-stencillift” finished use. Over life report to MRB. Long time production down orchange model， re-storage paste in a new jar if not over one hours， and record”R” and “solder Paste control label” for “re-use” record. Refrigeration storagebefore next use.The time from solder paste printing to reflow less than 45mins.G. 放置在车间的锡膏罐或贴片胶筒要盖盖子，必须在2天（参考其On-floor shelf life）内使用完毕，超期报MRB处理。遇长时间停机或更换产品型号，如未超过45分钟则填写“锡膏回收使用标签”（附件6）作为“可重复使用”的标识，可储存于冰箱中，下次优先回温使用。Control on floorpaste on jar within two days (according to ”on-floor shelf life”)over two daysreport to MRB.Longtime production down or change model， stick “solder paste reuse label” for“re-use” record and refrigeration storage if not over 45 mins before next use.(Seeappendix 6).H. “重复使用“的次数定义为1次。特殊情况时可由MRB决定”重复使用“的次数。1次定义为：锡膏第二次回温。One times forre-use paste and adhesive. Add times of re-use by MRB according balance shelflife of paste and SMD adhesive.The definition of reuse once is the solder pastebe thawed at second time7.附件清单